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BBY 56-02V H6327

BBY 56-02V H6327

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    SOD523(SC-79)

  • 描述:

    二极管配置:独立式;最大反向耐压(Vr):10V;反向电流(Ir):5nA@6V;二极管电容(CT):12.1pF@4V,1MHz;电容比:3.3@C1V/C4V;串联电阻(Rs):250mΩ;工作温...

  • 数据手册
  • 价格&库存
BBY 56-02V H6327 数据手册
BBY56... Silicon Tuning Diode • Excellent linearity • Low series resistance • Designed for low tuning voltage operation for VCO's in mobile communications equipment • Very low capacitance spread • Pb-free (RoHS compliant) package BBY56-02V BBY56-02W BBY56-03W  Type Package Configuration Marking BBY56-02V BBY56-02W* BBY56-03W SC79 SCD80 SOD323 single single single 9 66 red 6 * Not for new design Maximum Ratings at TA = 25 °C, unless otherwise specified Parameter Symbol Diode reverse voltage VR 10 V Forward current IF 20 mA Operating temperature range Top -55 ...150 °C Storage temperature TStg -55 ...150 1 Value Unit 2014-02-11 BBY56... Electrical Characteristics at TA = 25 °C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Reverse current IR nA VR = 6 V - - 5 VR = 6 V, TA = 85 °C - - 100 AC Characteristics Diode capacitance pF CT VR = 1 V, f = 1 MHz 37 40 43 VR = 2 V, f = 1 MHz 22 - 25 VR = 3 V, f = 1 MHz 14.8 15.8 16.8 VR = 4 V, f = 1 MHz - 12.1 - VR = 1 V, VR = 3 V, f = 1 MHz 2.15 2.53 - VR = 1 V, VR = 4 V, f = 1 MHz - 3.3 - - 0.25 - Capacitance ratio CT1/CT3 Series resistance rS Ω VR = 1 V, f = 470 MHz 2 2014-02-11 BBY56... Diode capacitance CT = ƒ (VR) Temperature coefficient of the diode f = 1MHz capacitance TCc = ƒ (VR) f = 1 MHz 100 0.0012 pF 1/K 0.001 80 0.0009 TCc CT 70 0.0008 60 0.0007 50 0.0006 40 0.0005 30 0.0004 20 0.0003 10 0 0 0.0002 1 2 V 3 0.0001 0 5 VR 1 2 3 4 V 6 VR Reverse current IR = ƒ(VR ) TA = Parameter 10 -9 125 °C A 10 -10 IR 85 °C 10 -11 60 °C 25 °C 10 -12 10 -13 1 2 3 V 5 VR 3 2014-02-11 Package SC79 4 BBY56... 2014-02-11 Package SCD80 BBY56... Package Outline 0.2 M A +0.05 0.13 -0.03 0.8 ±0.1 0.2 ±0.05 10˚MAX. 1.7 ±0.1 1 0.3 ±0.05 Cathode marking 7˚ ±1.5˚ 1.3 ±0.1 A 2 0.7 ±0.1 0.35 1.45 Foot Print 0.35 Marking Layout (Example) 2005, June Date code BAR63-02W Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Reel with 2 mm Pitch 2 0.2 2.5 8 1.45 Standard 4 Cathode marking 0.4 0.9 Cathode marking 5 0.7 2014-02-11 BBY56... Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 1) ) CES-Code Month 2 0 03 2 0 04 2005 2006 2 0 07 2008 2009 2010 2011 2012 2 0 13 2014 01 a p A P a p A P a p A P 02 b q B Q b q B Q b q B Q 03 c r C R c r C R c r C R 04 d s D S d s D S d s D S 05 e t E T e t E T e t E T 06 f u F U f u F U f u F U 07 g v G V g v G V g v G V 08 h x H X h x H X h x H X 09 j y J Y j y J Y j y J Y 10 k z K Z k z K Z k z K Z 11 l 2 L 4 l 2 L 4 l 2 L 4 12 n 3 N 5 n 3 N 5 n 3 N 5 1) New Marking Layout for SC75, implemented at October 2005. . 6 2014-02-11 Package SOD323 7 BBY56... 2014-02-11 BBY56... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany  2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 8 2014-02-11
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